退火与激活Annealing & activation

热处理可改变缺陷、应力与掺杂电学状态，结果取决于材料和热历程。A thermal history can change defects, stress and electrical dopant activation.

原理图解准备中Preparing the mechanism study

热处理可改变缺陷、应力与掺杂电学状态，结果取决于材料和热历程。Annealing & activation

非等比例原理示意，不代表设备或加工能力。Not-to-scale explanation, not an equipment or capability claim.

关键区别Key distinction

升温不等于所有缺陷自动消失；活化、扩散与应力变化需要分别评价。Heating does not guarantee defect elimination. Activation, diffusion and stress must be evaluated separately.

观察路径What to observe

初始材料状态Initial material state

错位节点示意缺陷，不是实际原子轨迹。Displaced nodes symbolize defects, not real atomic trajectories.

热预算作用Apply a thermal budget

温度与时间共同影响材料变化。Temperature and time together influence material changes.

重排与激活Rearrangement and activation

有序程度与掺杂活化是两个需要区分的指标。Structural order and dopant activation are distinct measures.

处理后的状态State after treatment

最终状态仍需测量，也可能伴随扩散。The outcome requires measurement and may include diffusion.

项目输入Project inputs

温度窗口、气氛、扩散、接触与材料兼容性Temperature window, ambient, diffusion, contacts and material compatibility.
整理项目需求Prepare a project brief ↗

进一步阅读Further reading

动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.