微纳结构加工Micro/nano fabrication版图、材料与工艺协作Pattern. Material. Process.

微细图形、薄膜与器件样品。素微协助你核对加工条件，组织工艺路线与资源对接。Microstructures, films and device samples. We help review requirements, plan process routes and connect fabrication resources.

聊加工需求Discuss a project 浏览工艺Explore processes

自动演示保持整体视角。点击表面小点或滚轮缩放，主动进入细节。拖动可360度旋转，不暂停工艺；拖偏后轻点模型回正，再点推进下一个知识点。点击控制栏的返回整体，平滑退出细节并继续当前演示，不重播。当前工艺结束后先退回整体，再播放下一项独立工艺；再次主动探索才进入它的细节。这不是必经加工流程。方向键旋转，加减键缩放，Enter继续，Home返回整体。Autoplay stays in the overall view. Click a surface point or zoom to explore details. Drag without pausing; tap to recenter after dragging, then tap to advance a knowledge beat. Overview smoothly returns without restarting. A completed study retreats before the next independent study begins; enter again to explore its details. Studies are not a mandatory route. Arrows rotate, plus/minus zoom, Enter advances, Home returns.

紫外掩模曝光UV mask exposure

选择一个原理演示Choose a principle study

表面准备Surface preparation

曝光与直写Exposure & direct writing

图形转移与复制Pattern transfer & replication

沉积镀膜与生长Deposition & growth

掺杂与热处理Doping & thermal processing

独立原理示意，非实际加工顺序Independent studies, not a fabrication sequence

周期沟槽与柱阵列的原创结构概念图 — 结构概念图，非实测图像Concept illustration, not measured data

先看你要做的结构Start with the structure

一张版图，需要的不只是曝光。材料、图形、膜层和检测方式，决定了后面的工艺选择。A layout needs more than exposure. Materials, geometry, films and inspection determine the process choices that follow.

周期结构Periodic structures: 光栅、柱阵列、超表面。先核对周期、深宽比与目标材料。Gratings, pillar arrays and metasurfaces. Review pitch, aspect ratio and material.
薄膜与电极Films & electrodes: 金属图形、介质膜层。一起确认附着、厚度、下切与后续测试。Metal patterns and dielectric films. Review adhesion, thickness, undercut and testing.

查看应用与加工要点Applications & preparation 讨论我的结构Discuss my design

按工艺查阅Find a process

从表面到内部，从单层到集成。按问题找到合适的工艺。From surfaces to materials and integration. Explore by the problem you need to solve.

表面准备Surface preparation

从表面状态开始，控制污染、残胶与界面。Start with contamination, residues and interfaces.

湿法清洗Wet cleaning 等离子体清洗与活化Plasma cleaning & activation

曝光与直写Exposure & direct writing

区分光源、成像方式与束形，先定义图形。Distinguish illumination, imaging and beam shape.

紫外掩模曝光UV mask exposure 深紫外投影曝光DUV projection 极紫外曝光EUV exposure 激光直写Laser direct writing 电子束直写Electron-beam writing 可变成形束电子束曝光Variable-shaped beam

图形转移与复制Pattern transfer & replication

去除、保留、复制与搬移，是不同的成形机制。Removal, retention, replication and relocation are distinct.

干法刻蚀Dry etching 湿法刻蚀Wet etching 剥离 Lift-offLift-off 纳米压印Nanoimprint 微转印Micro-transfer printing

沉积镀膜与生长Deposition & growth

从材料输运到表面反应，再到晶体生长。From material transport and surface chemistry to crystal growth.

蒸发镀膜 / PVDEvaporation / PVD 磁控溅射Magnetron sputtering 反应磁控溅射Reactive sputtering 离子辅助光学镀膜Ion-assisted deposition 化学气相沉积Chemical vapor deposition 原子层沉积Atomic layer deposition 外延生长Epitaxial growth

掺杂与热处理Doping & thermal processing

改变材料内部的组分与状态，而不只是表面形貌。Modify composition and state within the material.

离子注入Ion implantation 退火与激活Annealing & activation

集成与后道Integration & finishing

让独立结构成为能够连接、测试与交付的样品。Connect, finish and prepare structures for testing.

键合与封装Bonding & packaging 切割、减薄与抛光Dicing, thinning & polishing 表征与测试Metrology & testing

浏览完整工艺体系Explore the process atlas ↗

合作怎么开始Working together

合作流程Project workflow

把目标说清楚Clarify the goal
已有图纸、材料与期望结果先发来；缺少的条件，一起整理。Begin with your drawings, materials and intended result. We can help identify the missing inputs.
把路线与资源对上Match route and resources
协同核对工艺兼容性、关键风险与可对接资源，明确待验证的环节。Review process compatibility, key risks and available resources, including what still needs validation.
按确认的节点推进Proceed with agreed milestones
确认加工单位、报价、交期和验收要求，再协调样品与进度沟通。Confirm the supplier, quotation, schedule and acceptance criteria, then coordinate sample and progress communication.