切割、减薄与抛光Dicing, thinning & polishing
围绕最终外形、厚度和表面质量安排机械与化学机械处理。Mechanical and chemical-mechanical methods address final dimensions, thickness and surface quality.
关键区别Key distinction
切割、研磨与 CMP 各有目的，不是一条固定必经路线。Dicing, grinding and CMP have different purposes and are not a mandatory single route.
项目输入Project inputs
样品尺寸、厚度、保护、崩边与平整度Size, thickness, protection, chipping and flatness.
整理项目需求Prepare a project brief ↗
进一步阅读Further reading
动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.