曝光与直写Exposure & direct writing

激光直写Laser direct writing

依照数字版图,用光学束斑或调制光场直接曝光感光材料。A focused or spatially modulated optical field exposes photosensitive material from digital pattern data.

在首页观看原理演示Watch the interactive study ↗

原理图解准备中Preparing the mechanism study

激光直写Laser direct writing

依照数字版图,用光学束斑或调制光场直接曝光感光材料。Laser direct writing

非等比例原理示意,不代表设备或加工能力。Not-to-scale explanation, not an equipment or capability claim.

关键区别Key distinction

无掩模曝光不等于激光烧蚀;本示意没有移除基底材料。Maskless exposure is not laser ablation; this study does not remove substrate material.

观察路径What to observe

数字版图A digital pattern

不放置实体光掩模,写入来自数字图形。A digital pattern replaces a physical photomask.

聚焦光学写入Focused optical writing

光束扫过胶层,轨迹不是烧蚀沟槽。Light scans the resist without ablating a trench.

潜像与显影Latent image and development

胶内曝光差异,随后由显影显现。Development reveals differences stored in the resist.

保留胶图形A resist pattern remains

此处演示光学直写,不代表双光子体积打印。This optical writing example is not volumetric two-photon printing.

项目输入Project inputs

光刻胶、图形尺寸、写入面积、灰度与拼接Resist, feature size, writing area, grayscale and stitching.
整理项目需求Prepare a project brief ↗

进一步阅读Further reading

相关技术专题Related technical topic ↗
Illinois MRL:无掩模激光曝光 ↗

动画为非等比例原理示意,粒子、颜色、光路及材料厚度为解释性表达,不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.