等离子体清洗与活化Plasma cleaning & activation

通过活性物种与表面作用，去除部分有机残留或改变表面状态。Plasma-generated species remove some organic residues or modify the surface state.

原理图解准备中Preparing the mechanism study

通过活性物种与表面作用，去除部分有机残留或改变表面状态。Plasma cleaning & activation

非等比例原理示意，不代表设备或加工能力。Not-to-scale explanation, not an equipment or capability claim.

关键区别Key distinction

去残胶、去胶和表面活化并非同义；需考虑材料损伤与后续界面。Descum, resist stripping and activation are not interchangeable. Damage and the next interface require evaluation.

观察路径What to observe

残胶与表面Residue and surface

浅色薄层代表待处理的有机残留。A pale film represents organic residue.

活性物种接触Reactive species arrive

等离子体产生的活性物种作用于表面。Plasma-generated species interact with the surface.

残留减少Residue decreases

移除残留与改变表面化学可能同时发生。Residue removal and surface chemistry changes may coexist.

界面等待下一步An interface for the next step

活化效果与时效、污染再吸附和材料有关。Activation depends on material, aging and recontamination.

项目输入Project inputs

残留类型、敏感材料、功率窗口与后续黏附需求Residue, sensitive materials, process window and adhesion needs.
整理项目需求Prepare a project brief ↗

进一步阅读Further reading

动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.