曝光与直写Exposure & direct writing

极紫外曝光EUV exposure

使用约 13.5 nm 极紫外光、反射式掩模与反射光学,在真空光路中传递图形并曝光。Approximately 13.5 nm EUV light uses reflective masks and mirrors to convey a pattern through a vacuum optical path.

在首页观看原理演示Watch the interactive study ↗

原理图解准备中Preparing the mechanism study

极紫外曝光EUV exposure

使用约 13.5 nm 极紫外光、反射式掩模与反射光学,在真空光路中传递图形并曝光。EUV exposure

非等比例原理示意,不代表设备或加工能力。Not-to-scale explanation, not an equipment or capability claim.

关键区别Key distinction

不能把普通透射掩模加上 EUV 标签;此入口解释原理,不声明平台具备 EUV 产线。EUV is not a transmissive mask relabeled with a shorter wavelength. This study does not imply access to an EUV production line.

观察路径What to observe

反射掩模A reflective mask

EUV 不使用普通透射掩模。EUV uses a reflective rather than transmissive mask.

反射光学传递Reflective optical path

反射镜引导光线;此处压缩光路说明关系。Mirrors guide light; this is a reduced optical schematic.

真空中的曝光Exposure in vacuum

光路需真空环境,胶内响应被视觉放大。The path requires vacuum; resist response is exaggerated.

显影与图形Development and pattern

曝光与显影分开,未模拟真实缺陷统计。Exposure and development remain separate; stochastic defects are not simulated.

项目输入Project inputs

材料与工艺研究目标、胶体系、缺陷与统计性Research objective, resist system and stochastic defect considerations.
整理项目需求Prepare a project brief ↗

进一步阅读Further reading

相关技术专题Related technical topic ↗
ASML:透镜与反射镜 ↗

动画为非等比例原理示意,粒子、颜色、光路及材料厚度为解释性表达,不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.