靶与样品Target and substrate
上方靶材提供成膜物质，样品位于下方。The target supplies material to the substrate below.
磁控溅射Magnetron sputtering
离子轰击靶材，溅出的材料输运到基底形成薄膜。Ion bombardment ejects target material, which travels to the substrate and forms a film.
在首页观看原理演示Watch the interactive study ↗磁控溅射Magnetron sputtering
离子轰击靶材，溅出的材料输运到基底形成薄膜。Magnetron sputtering
关键区别Key distinction
属于 PVD；磁场影响放电中的电子运动，不是磁铁把材料吸到样品上。Magnetron sputtering is PVD. The magnetic field affects discharge electrons; it does not pull film material onto the sample.
观察路径What to observe
离子轰击靶面Ions strike the target
离子把靶材原子溅出，不是直接落成同一层。Ion bombardment ejects target material.
材料到达样品Material reaches the sample
溅出物输运并沉积，方向分布被简化。Ejected material travels and deposits; angular spread is simplified.
膜层形成A film forms
膜厚增长之外，还需评价应力与界面。Film growth is distinct from stress and interface quality.
项目输入Project inputs
靶材、基底、膜厚、应力、覆盖与损伤Target, substrate, thickness, stress, coverage and damage.
整理项目需求Prepare a project brief ↗
进一步阅读Further reading
动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.