微转印Micro-transfer printing

通过印章拾取已有微结构，再定位并释放到接收基底。A stamp picks up preformed microstructures and places them on a receiving substrate.

原理图解准备中Preparing the mechanism study

通过印章拾取已有微结构，再定位并释放到接收基底。Micro-transfer printing

非等比例原理示意，不代表设备或加工能力。Not-to-scale explanation, not an equipment or capability claim.

关键区别Key distinction

搬移已有结构不同于压印塑形；本例不代表所有转印路线。Moving existing structures differs from imprint molding. The example does not represent every transfer route.

观察路径What to observe

供体上的结构Structures on the donor

器件已预先形成，本段不会再次压出图形。Structures already exist; the stamp does not mold them here.

印章拾取Stamp pickup

界面黏附使微结构随印章离开供体。Interfacial adhesion allows pickup from the donor.

移动与对准Move and align

同一组微结构被带到接收位置。The same structures move to the receiver.

释放到接收基底Release onto the receiver

结构留下、印章离开，释放机制因路线而异。Structures remain as the stamp leaves; release mechanisms vary.

项目输入Project inputs

供体、接收基底、界面黏附、对准与释放方式Donor, receiver, interfacial adhesion, alignment and release.
整理项目需求Prepare a project brief ↗

进一步阅读Further reading

动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.