工艺小站 04Process Stop 04

键合与封装Bonding & Packaging

适合晶圆键合、玻璃硅键合、PDMS/微流控封装、空腔和密封结构。For wafer bonding, glass-silicon bonding, PDMS/microfluidic packaging, cavities and sealing.

发送需求邮件Send Request 看阳极键合专题Open Anodic Bonding 看气密性与泄漏测试专题Open Hermeticity Testing 看引线键合封装专题Open Wire Bonding 看倒装焊封装专题Open Flip Chip 看 RDL 再布线层专题Open RDL 看晶圆级封装 WLP 专题Open WLP 看临时键合与解键合专题Open Temporary Bonding 返回工艺导航Back to Process Map

适合什么需求Good For

晶圆键合、玻璃硅键合、PDMS 封装Wafer bonding, glass-silicon bonding and PDMS packaging
微流控芯片、MEMS 空腔、密封结构Microfluidic chips, MEMS cavities and sealed structures
需要对准、表面状态和测试接口一起判断的项目Projects requiring alignment, surface state and test-interface review

先准备什么Prepare First

材料组合、尺寸、表面粗糙度和清洁状态Material pair, size, surface roughness and cleanliness
对准要求、空腔结构和密封要求Alignment, cavities and sealing requirements
是否已有图形、薄膜或前道工艺Existing pattern, film or prior process
后续测试、引线、进出液或电连接方式Downstream test, wiring, fluidic or electrical connection

通常会找谁Who Usually Helps

MEMS 工艺平台MEMS process platforms
微流控加工公司Microfluidic fabricators
晶圆键合平台Wafer bonding platforms
封装与测试供应商Packaging and test suppliers

先把这些说清楚What to Spell Out

把这些说清楚，别人就不用隔空猜样品；报价和可行性也会靠谱很多。When these points are clear, nobody has to guess the sample from thin air; feasibility and quotes get much more reliable.

片源尺寸Wafer Size
表面状态Surface State
对准要求Alignment
空腔/密封Cavity/Seal
测试连接Test Access

懒人邮件模板Quick Email Template

1. 项目目标：想做什么结构，用于什么测试或验证。1. Project goal: target structure and intended test or validation.

2. 材料与样品：衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.

3. 版图与尺寸：GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.

4. 工艺与验收：目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.

发送到 sunyvsheng@gmail.comEmail sunyvsheng@gmail.com

晶圆级项目先看专项准备页Start Wafer-Level Projects Here

涉及阳极键合、硅硅直接键合、低温键合或 MEMS 空腔封装时，先整理上下片材料、表面状态、对准和气密验收。For anodic, direct, low-temperature or MEMS cavity bonding, prepare wafer surfaces, alignment and hermetic acceptance.

查看晶圆键合加工准备页Open wafer bonding topic 查看气密性测试与泄漏率评估准备页Open hermeticity and leak-testing topic 查看等离子表面活化与亲水处理准备页Open plasma-activation handoff page 查看阳极键合加工准备页Open anodic-bonding topic 查看 TSV 硅通孔工艺需求页Open TSV process topic 查看玻璃通孔 TGV 工艺需求页Open TGV process topic 查看引线键合封装准备页Open wire-bonding handoff page 查看倒装焊与焊凸点准备页Open flip-chip and bump handoff page 查看 RDL 再布线层与 I/O 重排准备页Open RDL and I/O redistribution handoff page 查看晶圆级封装 WLP 需求准备页Open WLP handoff page 查看临时键合与解键合需求准备页Open temporary-bonding handoff page