工艺小站 03Process Stop 03
镀膜与 Lift-offFilms & Lift-off
适合金属电极、光学薄膜、种子层、功能膜、Lift-off 和去胶清洗。For metal electrodes, optical films, seed layers, functional films, lift-off and resist removal.
适合什么需求Good For
- 金属电极、光学薄膜、功能膜和种子层Metal electrodes, optical films, functional films and seed layers
- 蒸发、溅射、ALD/CVD 或组合薄膜Evaporation, sputtering, ALD/CVD or combined films
- Lift-off、去胶、残留控制和后续测试连接Lift-off, resist removal, residue control and test connections
先准备什么Prepare First
- 镀膜材料、目标膜厚和附着层Film material, target thickness and adhesion layer
- 图形尺寸、边界要求和是否 Lift-offPattern size, edge requirements and lift-off need
- 基底耐温、已有膜层和前道状态Substrate temperature limit, existing films and incoming state
- 后续电学/光学测试方式和验收标准Downstream electrical/optical test and acceptance criteria
通常会找谁Who Usually Helps
- 蒸发/溅射平台Evaporation/sputtering platforms
- ALD/CVD 薄膜平台ALD/CVD film platforms
- 金属薄膜服务商Metal film suppliers
- 微纳加工公司或高校公共平台Microfabrication companies or shared university platforms
先把这些说清楚What to Spell Out
把这些说清楚，别人就不用隔空猜样品；报价和可行性也会靠谱很多。When these points are clear, nobody has to guess the sample from thin air; feasibility and quotes get much more reliable.
懒人邮件模板Quick Email Template
1. 项目目标：想做什么结构，用于什么测试或验证。1. Project goal: target structure and intended test or validation.
2. 材料与样品：衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.
3. 版图与尺寸：GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.
4. 工艺与验收：目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.
发送到 sunyvsheng@gmail.comEmail sunyvsheng@gmail.com
查看镀膜加工与薄膜沉积准备页Open film deposition prep page
查看 ALD 原子层沉积准备页Open ALD deposition prep page
查看 PECVD 薄膜沉积准备页Open PECVD deposition prep page
查看 LPCVD 薄膜沉积准备页Open LPCVD deposition prep page
查看磁控溅射镀膜准备页Open sputtering prep page
查看电子束蒸发镀膜准备页Open evaporation prep page
查看 Lift-off 金属电极准备页Open lift-off electrode prep page