输入条件Inputs
材料、片源、版图、目标尺寸、前道状态和不能承受的工艺限制。Materials, samples, layout, target dimensions, prior state and process limits.
报价前别空手Before Quoting
项目资料与验收清单Project inputs & acceptance checks
这里放通用检查表。不是为了把沟通变复杂，而是为了少一点“这个我没说吗”的尴尬时刻。以后有可公开样品图，也会慢慢补进来。Reusable checks live here. The goal is not more paperwork; it is fewer missing-detail moments.
01 报价前检查01 Before Quotation
报价与工艺评估所需资料Inputs for quotation and process assessment
目标结构说明要做什么结构，用于什么测试或验证。Target structure and intended validation.
版图文件GDS/DXF/PDF、截图、top cell、layer 说明。GDS/DXF/PDF, screenshots, top cell and layers.
关键尺寸最小线宽、线距、周期、孔径、面积和深宽比。CD, spacing, period, holes, area and aspect ratio.
材料堆栈基底、膜层、厚度、片径、数量和前道状态。Substrate, films, thickness, wafer size, quantity and prior state.
工艺目标刻蚀深度、膜厚、套刻、lift-off、键合或检测目标。Etch depth, film thickness, overlay, lift-off, bonding or metrology targets.
验收标准用 SEM、显微、轮廓、电学或光学数据验收。Acceptance by SEM, optical, profile, electrical or optical data.
风险限制温度、化学品、污染、应力、崩边、残胶和样品脆弱性。Temperature, chemicals, contamination, stress, chipping, residue and fragility.
交付要求样品数量、照片、测试记录、交付时间和复盘建议。Quantity, images, test records, timeline and review notes.
02 案例记录模板02 Case Record Template
可复核的样品与案例记录Traceable sample and case records
工艺路径Process Route
写清采用了哪些工艺环节、顺序、关键参数和中间检查点。List steps, sequence, key parameters and intermediate checks.
输出结果Output
样品、显微/SEM 图、尺寸记录、测试数据、问题复盘和下一轮建议。Samples, SEM/optical images, dimensions, test data, issues and next suggestions.
03 常见问题03 Common Issues
加工前需要确认的风险Risks to clarify before fabrication
图形与套刻Pattern and Overlay
最小线宽、线距、曝光面积、套刻 mark、胶型和版图层号不清，都会影响判断。CD, space, exposure area, marks, resist and layers affect feasibility.
刻蚀和膜层风险Etch and Film Risk
侧壁形貌、选择比、膜层应力、附着力、残胶和污染需要提前说明。Sidewall profile, selectivity, film stress, adhesion, residue and contamination matter.
样品处理风险Sample Handling
小片、薄片、脆性材料、已加工样品、贵重样品要提前说明保护方式。Small, thin, fragile, pre-processed or valuable samples need handling notes.
项目沟通邮件模板Project inquiry template
1. 项目目标：想做什么结构，用于什么测试或验证。1. Project goal: target structure and intended validation.
2. 材料与样品：衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.
3. 版图与尺寸：GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.
4. 工艺与验收：目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.
需要指导Need Guidance
资料不完整也能先聊，别让项目卡在开头。Incomplete inputs can still start the conversation.
我可以先把现有条件整理成别人能判断的说法，再看要不要补版图、补检测方式，或者把工艺目标重新说一遍。I can organize what exists first, then decide whether layout, metrology or the process goal needs more work.
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