白光干涉三维形貌测量White-light interferometry for 3D topography

把“看一下表面高低”转换成可测区域、横向视场、垂直指标、测点图和可交付的数据。Turn “inspect the surface profile” into a measurable area, field of view, vertical metric, point map and deliverable.

它适合回答什么What it is suited to answer

白光干涉三维形貌测量适合在非接触条件下观察台阶、沟槽、凸起、表面起伏和较大区域的三维高度分布。它可帮助把工艺后的“有没有残留、深度是否均匀、结构边缘是否异常”变成有位置和处理条件的形貌证据；具体分辨率、可测坡度、反射率范围与拼接能力由接收平台和物镜配置确认。White-light interferometry can inspect steps, trenches, raised structures and 3D height distribution without contacting the surface. Resolution, slope tolerance, reflectivity range and stitching capability depend on the receiving tool and objective configuration.

适合什么需求Good For

微结构台阶、刻蚀深度、MEMS 形貌、镀膜或图形后的局部起伏、多点面形比较，以及需要高度图、截线和统计参数的项目。Microstructure steps, etch depth, MEMS topography, local height variation after films or patterning, and reports requiring maps, profiles and statistics.

需要准备什么Prepare First

样品材料、尺寸和厚度，正反面与可放置方式，目标区域照片或版图，预估高度/深度、最陡边缘、反射或透明特性、测点坐标、是否需要拼接，以及高度图、截线、原始数据或统计结果。Provide material, dimensions, mounting orientation, target-area photo or layout, expected height/depth, steepest edges, optical behavior, point map, stitching need and required data outputs.

常见风险Common Risks

高反光、低反射、透明多层、强倾斜侧壁、深窄沟槽、悬空结构、污染或样品翘曲都可能改变可测性或重建结果。不同物镜、滤波、去倾斜、缺失点处理和统计窗口下的数据不能直接横比。Highly reflective, weakly reflective or transparent stacks, steep walls, narrow trenches, suspended structures, contamination and warpage can affect measurability and reconstruction. Results require matching objectives and processing settings for comparison.

送样与验收怎样写才可执行Make handoff and acceptance executable

先在照片或版图上标注每个测区、扫描方向和需要避开的边缘；同一比较组固定物镜、视场、采样策略、平面校正和统计区域。验收应明确是看单点台阶、区域高度差、粗糙度、翘曲趋势还是缺陷位置，并保留三维高度图、关键截线、测点坐标、处理设置和异常说明。若要比较工艺前后，尽量保留同一基准和同一定位方式。Mark every region, scan direction and edge exclusion on a photo or layout. Fix the objective, field, sampling, leveling and statistics area within a comparison set, and retain maps, profiles, coordinates, processing settings and anomalies.

与台阶仪、AFM 和椭偏的边界Boundary with profilometry, AFM and ellipsometry

白光干涉关注较大视场内的非接触三维形貌，不替代所有高度或膜厚测量。若重点是单条扫描线与接触式轮廓，可先看台阶仪膜厚与台阶高度；若重点是小区域纳米级粗糙度，核对AFM 表面粗糙度；若重点是平整薄膜的光学膜厚与折射率，核对椭偏仪膜厚测试。This topic covers non-contact 3D topography over a useful field of view. Use profilometry for line traces, AFM for nanoscale local roughness, and ellipsometry for optical film thickness and index on suitable films.

推荐下一步Next Step

先提交测点图和想回答的问题，再确认视场、物镜与报告口径。Submit a point map and measurement question before selecting field, objective and report format.

素微会先将样品状态、目标尺寸和验收用途整理为可核对的表征需求，再匹配合适的测试资源；不把页面描述当作任何设备、精度或结果的预先承诺。素微 first turns sample state, target dimensions and acceptance use into a checkable request; this page is not a pre-commitment to tool availability, precision or result.

提交三维形貌测量需求Submit 3D-topography request 查看表征与测试导航Open metrology route