适合什么需求Good For
- SEM、光学显微、AFM、轮廓仪和椭偏SEM, optical microscopy, AFM, profilometry and ellipsometry
- 电学、光学、RF 测试和失效分析Electrical, optical, RF tests and failure analysis
- 需要把结果整理成下一轮工艺依据的项目Projects that need results converted into next-round process decisions
工艺小站 09Process Stop 09
表征与测试Metrology & Testing
适合 SEM、显微、轮廓、椭偏、电学、光学、RF 测试和失效分析。For SEM, optical imaging, profilometry, ellipsometry, electrical, optical, RF tests and failure analysis.
先准备什么Prepare First
- 样品状态、检测位置和要看的结构Sample state, locations and target structures
- 目标尺寸、关键指标和验收标准Target dimensions, key metrics and acceptance criteria
- 是否需要截面、倾斜角、标尺或统计数据Cross-section, tilt, scale bar or statistical data needs
- 报告格式、原始图像和数据交付方式Report format, raw images and data delivery method
通常会找谁Who Usually Helps
- SEM/AFM/轮廓仪平台SEM/AFM/profilometer platforms
- 探针台和电学测试资源Probe-station and electrical test resources
- 光学/RF 测试平台Optical/RF test platforms
- 第三方检测机构Third-party labs
先把这些说清楚What to Spell Out
把这些说清楚，别人就不用隔空猜样品；报价和可行性也会靠谱很多。When these points are clear, nobody has to guess the sample from thin air; feasibility and quotes get much more reliable.
懒人邮件模板Quick Email Template
1. 项目目标：想做什么结构，用于什么测试或验证。1. Project goal: target structure and intended test or validation.
2. 材料与样品：衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.
3. 版图与尺寸：GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.
4. 工艺与验收：目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.